UID:
almahu_9948025904802882
Format:
1 online resource (1173 p.)
Edition:
1st ed.
ISBN:
1-281-05224-8
,
9786611052249
,
0-08-048031-4
Content:
The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology.Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible.* Offers detailed derivation of important formulae.* Thoroughly cove
Note:
Description based upon print version of record.
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Front Cover; Principles of Physical Vapor Deposition of Thin Films; Copyright; Contents; Acknowledgements; Chapter 01 INTRODUCTION; 1.1. Introduction; Problems; References; Chapter 02 EVAPORATION; 2.1. Process of Thin Film Formation by Evaporation; 2.2. Thermodynamics of Evaporation; 2.2.1. Equilibrium condition for phase transformation in one-component systems; 2.2.2. Clausius-Clapeyron equation; 2.2.3. Source container interaction; 2.2.4. Changes in composition during alloy evaporation; 2.2.5. Stability of compounds and non-stoichiometry; 2.2.6. Chemical reactions and equilibrium
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2.3 Kinetic Theory of Gases2.3.1. Calculation of pressure; 2.3.2. Distribution of molecular velocities; 2.3.3. Calculation of averages using the distribution function; 2.3.4. Maxwell velocity distribution function in a force field; 2.3.5. Number of molecules striking a surface; 2.3.6. Evaporation; 2.3.7. Effusion; 2.3.8. Emission characteristics of vapor sources; 2.3.9. Thermal transpiration; 2.4. Elementary Description of Collision Processes; 2.4.1 Mean free path; 2.4.2. Mean time between collisions; 2.4.3. Collision frequency; 2.4.4. Collision cross section
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2.5. Classical Theory of Binary Collisions2.5.1. Kinematic theory of collisions; 2.5.2. Center of mass and relative position coordinates; 2.5.3. Motion of a particle in a central field of force; 2.5.4. Equation of motion; 2.5.5. Classification of trajectories; 2.5.6. Impact parameter and angle of scattering; 2.5.7. Relationship between differential scattering cross section and impact parameter and scattering angle; 2.5.8. Differential scattering cross section for columbic potential; 2.5.9. Center of mass to laboratory transformation of coordinates; Problems; References
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Chapter 03 PLASMA STATE3.1. Introduction; 3.2. Plasma State; 3.3. Thermal and Non-Thermal Plasma; 3.4. Collisions in Plasma; 3.4.1. Excitation collisions; 3.4.2. Ionization collisions; 3.4.3. Charge exchange collisions; 3.4.4. Collisions involving metastables; 3.4.5. Recombination and attachment; 3.4.6. Dissociation; 3.4.7. Heterogeneous reactions; 3.5. Behavior of Plasma in Electric and Magnetic Fields; 3.5.1. Constant and uniform electric field, no magnetic field; 3.5.2. Constant and uniform magnetic field, no electric field; 3.5.3. Uniform electric and magnetic fields
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3.5.4. Non-uniform magnetic fields3.5.5. Drift velocity due to other fields; 3.6. Basic Equations in Cold Plasma; 3.6.1. Boltzmann equation; 3.6.2. Macroscopic averages; 3.6.3. Flux of macroscopic quantities; 3.6.4. Rate of change of macroscopic quantities; 3.7. Macroscopic Characterization of Plasma; 3.8. Collective Phenomena in Plasma; 3.8.1 Shielding of a charge in a plasma; 3.8.2. Plasma parameter; 3.8.3. Diffusion of charges; 3.8.4. Plasma oscillations; 3.8.5 Collision frequencies; 3.9. Waves in Cold Plasma; 3.9.1. Electrostatic waves
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3.9.2. Plasma waves in the presence of a magnetic field
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English
Additional Edition:
ISBN 0-08-044699-X
Language:
English
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