UID:
almahu_9948026138602882
Format:
1 online resource (591 p.)
ISBN:
1-283-17380-8
,
9786613173805
,
0-08-053353-1
Series Statement:
Handbook of low and high dielectric constant materials and their applications ; v. 2
Content:
Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low the
Note:
Description based upon print version of record.
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Front Cover; Handbook of Low and High Dielectric Constant Materials and Their Applications; Copyright Page; Contents; Preface; About the Editor; List of Contributors; Chapter 1. LOW DIELECTRIC CONSTANT MATERIALS FOR INTERLAYER DIELECTRICS; 1. The Need for Low Dielectric Constant (Low-er) Interlayer Dielectrics; 2. Current Status of the Technology; 3. Low-er Materials; 4. Deposition of Polymer Thin Films; 5. Electrical Characterization of Dielectric Materials; 6. Summary; Acknowledgments; References
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Chapter 2. LOW DIELECTRIC CONSTANT GLASSES AND GLASS-CERAMICS FOR ELECTRONIC PACKAGING APPLICATIONS1. Introduction; 2. Substrate Materials for Electronic Packaging; 3. Fundamental Concepts of Low-Dielectric-Constant Dielectric Materials; 4. Low-Dielectric-Constant Glass and Glass-Ceramic Systems; 5. Chemical Processing of Glasses and Nonoxide Ceramics; 6. Oxynitride Glasses; 7. Modified Oxide Sol-Gel Approaches to Synthesize Borophosphosilicate Glasses and Glass-Ceramics; 8. Development of Borophosphosilicate Glasses and Glass-Ceramics
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9. Incorporation of Nitrogen and Its Influence on the Structure and Dielectric Properties of Borosilicate Glasses10. Conclusions; 11. Summary and Prospects; Acknowledgements; References; Chapter 3. LOW-k AMORPHOUS CARBON FILMS FOR INTERCONNECTS OF SUBMICRON-SCALE DEVICES; 1. Deposition of Amorphous Carbon Thin Films; 2. Integration of Fluorinated Amorphous Carbon; 3. Summary; Acknowledgments; References; Chapter 4. CYANATE ESTER RESINS WITH LOW DIELECTRIC PROPERTIES AND APPLICATIONS; 1. Introduction; 2. Historical Developments; 3. Cyanate Ester Resin Chemistry; 4. Dielectric Properties
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5. Applications6. Conclusion; Acknowledgments; References; Chapter 5. LOW DIELECTRIC CONSTANT EPOXY RESINS; 1. Introduction; 2. The Key Technology of Low Dielectric Constant Epoxy Resins; 3. Alkyl Phenol Novolac Epoxy Resins; 4. Dicyclopentadiene Epoxy Resins; 5. Active Ester Novolac Hardeners; 6. Conclusions; Acknowledgments; References; Chapter 6. CHEMICAL MECHANICAL POLISHING OF ORGANIC POLYMERIC MATERIALS FOR IC APPLICATIONS; 1. Introduction; 2. Historical Perspective on Polymer Chemical Mechanical Polishing; 3. Description of Dielectric Chemical Mechanical Polishing
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4. Fundamental Physical Mechanisms in Dielectric Chemical Mechanical Polishing5. Previous LOW-K Chemical Mechanical Polishing Work; 6. Chemical Mechanical Polishing of FLARE; 7. Chemical Mechanical Polishing Performance of ZrO2-Based Slurry on FLARE; 8. Surface Structure of Polished FLARE Films; 9. Summary; Acknowledgments; References; Chapter 7. DIELECTRIC SPECTROSCOPY OF CRYSTALLINE POLYMERS AND BLENDS; 1. Introduction; 2. Background; 3. Single-Component Systems; 4. Polymer Blends; 5. Conclusions; References; Chapter 8. METALLOPHTHALOCYANINES AS HIGH-DIELECTRIC CONSTANT MATERIALS
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1. Monomeric Phthalocyanines
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English
Additional Edition:
ISBN 0-12-513905-5
Language:
English
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