Format:
1 Online-Ressource (282 Seiten)
ISBN:
9783030617097
Series Statement:
Microsystems and Nanosystems Ser
Note:
Intro -- Foreword -- Preface -- Acknowledgements -- Abbreviations -- Contents -- About the Authors -- Part I: Context and Overview -- Chapter 1: The Opportunities and Challenges of MEMS Product Development -- Why Are MEMS So Challenging? -- Three-Dimensional Features Impede Process Flow Standardization -- Complex Processes and Microscale Physics Impair Precise Simulation -- MEMS Foundries Must Qualify each New Process Flow -- Planning for Successful MEMS Product Development -- Summary -- References -- Chapter 2: Economics of Semiconductor Device Manufacturing and Impacts on MEMS Product Development -- Economics of Silicon Wafer Manufacturing -- Parallel Fabrication Enables Economy of Scale -- Large Product Volumes Defray the Huge Capital Cost of Wafer Fabs -- Captive Fabs, Foundries, and the Fabless Model -- How MEMS Production Differs from Semiconductor Production -- MEMS Devices Are Physically Different from Electronic Semiconductor Devices -- MEMS Lack Standard Processes -- MEMS Products Have Lower Wafer Volumes per Process -- Summary -- References -- Chapter 3: Stages of MEMS Product Development -- The Five Stages to Commercialize a MEMS Product -- Proof-of-Concept Prototype -- Advanced Prototypes -- Foundry Feasibility -- Foundry Pilot Production Stage -- Foundry Production -- Funding and Schedule for the Five Stages -- Typical Budget and Timeline for Stages of Development -- Secure Continuous Funding for Efficient Product Development -- Summary -- References -- Part II: Business Requirements for a Viable Product -- Chapter 4: What Is the Product? Requirements Analysis -- Understanding the Market -- Market Perspective Frames Product Requirements Analysis -- Technology Push -- Market Pull -- Which Parties Dictate the Product Requirements? -- Understanding Technical Requirements -- Functional Requirements -- Environmental Requirements
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Interface and Package Requirements -- Calibration Requirements -- Quality and Regulatory Requirements -- Understanding Business Requirements -- Unit Price Requirements -- Overcoming Existing Barriers to Entry -- Satisfying Intermediary Integrators -- Arranging Security of Supply -- Summary -- References -- Chapter 5: Is There a Business Opportunity? Product Unit Cost Modeling -- Rough Order of Magnitude Unit Cost -- Step 1: Calculate Number of Wafers Needed to Fabricate the Number of Units to be Sold in a Year -- Step 2: Calculate ROM MEMS Die Unit Cost -- Gain Insights from Parameter Sensitivity Analyses -- Detailed Unit Cost Model -- Step 1: Identify all Operations or Components of the Finished MEMS Product and Expected Yield for each -- Step 2: Gather Cost Data for each Manufacturing Operation -- Step 3: Assemble Model and Perform Parameter Sensitivity Analyses -- Track your Assumptions and Iterate the Model when Assumptions Change -- Advanced Unit Cost Modeling -- Beware of Common Blunders -- Summary -- References -- Chapter 6: What Is the Budget for Development? -- Understanding the Development Plan Cost Model Assumptions and Limitations -- Building a Level-of-Effort Cost Estimate -- Reducing Development Timelines -- Planning Staged Development and Go/No-Go Gates to Control Budget -- Go/No-Go Criteria for Moving to the Next Stage of Development -- Know your Company's Culture and Position to Inform your Development Plan -- Recouping Development Costs when Things Do Not Work out as Expected -- Summary -- References -- Chapter 7: Leveraging Third-Party Intellectual Property to Accelerate Product Development -- Academic Institutions or Universities -- Research Laboratories or Institutes -- Other Commercial Companies, Including Foundries -- Public Domain Knowledge -- Components for Purchase or "White-Label" Technology -- Summary -- References
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Chapter 8: Organization Planning for Successful Development -- Proof-of-Concept Stage: Start-Up Company or R& -- D Group within an Established Company -- Advanced Prototypes Stage: Start-Up Company or an Established Company Licensing MEMS Technology -- Foundry Development Stages: Start-up or Established Company -- Product Integration: Start-up or Established Company That Purchases Third-Party MEMS Components for Its MEMS-Enabled Product -- External Team Members -- Outsourcing to Vendors -- Vendor and Supply Chain Management -- Summary -- References -- Part III: Technical Requirements for a Viable Product -- Chapter 9: The MEMS Product: Functional Partitioning and Integration -- A MEMS Product Is a System -- Package -- Environmental Protection -- Electrical Connection -- Interaction with Phenomena -- Electrical Isolation -- Mechanical Isolation or Damping -- Other Functions -- Electronics -- Power -- Readout and Signal Processing -- Control -- Software -- Levels of Integration -- Board-Level Integration -- Package-Level Integration -- Known Good Die and Multichip Packages -- Die-Level Integration -- Trade-Offs to Consider in Integration -- A Common MEMS Product Embodiment -- Summary -- References -- Chapter 10: Starting a New MEMS Device Design -- Overview of New Product Design -- Explore the Design Space Using Analytical Models -- Using Design Space Plots -- Mind the Practical Limits of Analytical Models -- Building Useful and Meaningful Computational Models -- Build a Simple Model First and Validate It -- Incorporating Input from Other System Components -- Example of the Benefits of Simulation: Understanding Environment Impact on Device Performance -- Managing Uncertainty in Models -- Sources of Uncertainty in Modeling -- Parameter Sensitivity Analysis -- Example: Managing Boundary Condition and Material Property Uncertainties
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Use Measured Data to Improve Model Accuracy -- When Testing and Measurement are More Efficient or Useful than Simulation -- Business Factors in MEMS Design -- Leverage Simulation to Reduce the Cost, Risk, and Time of Product Development -- Summary -- References -- Chapter 11: Design for Manufacturing: Process Integration and Photomask Layout -- Assembling a MEMS Process Flow -- Common MEMS Process Modules -- Designing for Realistic Fabrication Conditions in Volume Production -- Using "Secret Sauce" Processes -- Creating a Process Flow Runsheet -- Leveraging Foundry Process Platforms -- Best Practices for Lithography and Photomask Layout -- Lithography Methods and Parameters -- Photoresist -- Alignment Strategy and Marks -- Setting up the Photomask Layout File -- Design Variants -- Testing, Packaging, and Assembly Layout Considerations -- Planning for Future Die Shrink -- Finalizing a Mask Layout -- Summary -- References -- Chapter 12: Design for Back-end-of-Line Processes -- Wafer Sort -- Wafer Thinning -- Singulation -- Package and Assembly -- Summary -- References -- Chapter 13: Strategies for Codevelopment of the Electronics and Package -- Codevelopment Challenges -- Using Proxies to Enable Parallel Development -- Electronics Development Proxies -- Leveraging Sensor Signal Conditioning (SSC) Chips and Microcontrollers -- System-Side Electronics Interfaces -- Packaging Development Proxies -- Examples of Codevelopment with Proxies -- Summary -- References -- Chapter 14: Planning a Development Test Program -- Understanding Test Types: Development Test vs. Manufacturing Test -- Development Test -- How Testing, Performance, Reliability, Product Qualification, and Failure Analysis Are Related -- Establishing Test Requirements -- Standard Tests can Leverage Existing Equipment and Expertise -- The Role of In-Field Testing in Defining Qualification Tests
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Establishing Test Capability -- Characterization Test is a Core Capability -- Developing Characterization Test Capability -- Information Quality vs. Test Speed and Volume -- Testing During vs. Before and After Exposure to Conditions -- Developing for In-Field Test Capability -- Best Practices for Enabling Failure Analysis -- Localize the Problem -- Observation Modes -- Using Test Structures -- Summary -- References -- Chapter 15: Risk Mitigation Strategies for Prototype Fabrication -- Knowing Your Organization's Tolerance for Risk -- Analyze Process Risks and Explore Trade-Offs -- Process Development Risk Mitigation Strategies -- Short loop Process Experiments -- Staging, Split Lots, and Look-Ahead Wafers -- Parallel Lot Processing -- Cost-Effective Planning -- After Spending the Money and Time, Be Sure to Harvest the Data -- Example: Using Fabrication Risk Mitigation Strategies -- Process Risk Mitigation in a Production Fab -- Summary -- References -- Chapter 16: Documenting MEMS Product Technology for Transfer to Manufacturing -- What Needs to Be Documented and Why -- Milestone Design Reviews -- System Functional Diagrams and Schematics -- Simulation Models and Results -- Documentation for MEMS Foundry Transfer -- Photomask Layout Data -- Photomask Layout File -- Photomask Layer Definition -- High-Level Process Flow Summary -- Layout Design Specifications -- MEMS Process Flow -- Runsheet and Process Tolerances -- Inspection and Acceptance Criteria -- Documentation for Other Supply Chain Vendors -- Back End, Packaging, and Other Supply Chain Vendors -- Process Quality Control and Qualification Test Documents -- Summary -- References -- Part IV: Technology Transfer and Scaling Up Manufacturing -- Chapter 17: Determining Readiness for Volume Production -- Understanding Development Versus Production Environments -- Staff Composition and Mindset
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Job queuing and Process Stability
Additional Edition:
Erscheint auch als Druck-Ausgabe Fitzgerald, Alissa M. MEMS Product Development Cham : Springer International Publishing AG,c2021 ISBN 9783030617080
Language:
English
Subjects:
Engineering
URL:
Volltext
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