ISSN:
1051-8207
In:
Institute of Electrical and Electronics Engineers, IEEE microwave and wireless components letters, New York, NY : Inst., 1991, 18(2008), 3, Seite 170-172, 1051-8207
In:
volume:18
In:
year:2008
In:
number:3
In:
pages:170-172
Language:
English
URL:
http://dx.doi.org/10.1109/LMWC.2008.916779
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