In:
SN Applied Sciences, Springer Science and Business Media LLC, Vol. 3, No. 1 ( 2021-01)
Abstract:
Metal 3D printing based on the photopolymerization reaction (Digital Light Processing—DLP) of an organic matrix in which metal particles are embedded is a developing technology. This technology requires a step of resin removal and densification by sintering to obtain a metal part. This process has been applied to copper. Photocurable formulations with a high loading rate of copper powder of 60 vol.% were developed and suitable for DLP printing with thicknesses 〉 25 µm. Debinding and sintering cycles were investigated on specimens fast cured by gamma irradiation to save materials and time. A debinding in air at 400 °C and sintering in hydrogen lead to a C content of 0.018 wt.%, similar to the raw copper powder and slightly higher oxygen content. The low thermal conductivity of 250 W·m −1 ·K −1 highlighted the harmful effect of phosphorus from the powder and photoinitiators such as BAPO. The C and O contents and the thermal conductivity measured on copper parts printed by DLP confirm the results obtained on specimens cured by gamma irradiation.
Type of Medium:
Online Resource
ISSN:
2523-3963
,
2523-3971
DOI:
10.1007/s42452-020-04049-3
Language:
English
Publisher:
Springer Science and Business Media LLC
Publication Date:
2021
detail.hit.zdb_id:
2947292-1
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