In:
Materials Science Forum, Trans Tech Publications, Ltd., Vol. 575-578 ( 2008-4), p. 919-923
Abstract:
Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A major
cause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, and Poisson’s ratios of the package materials. Here, the influence of delamination between epoxy and
dielectric layers on pattern shift and passivation cracking in IC package under aeronautical conditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximum
principal stresses theory using a certain 2D FEM model with different delamination length “L_c.right”. Delaminations are easy to introduce more dangerous impact to the package, because
the IC microstructures endure serious thermo-mechanical loading under aeronautical working conditions. The method can be used to find the dangerous designed structure schedules and will
provide a basis for selecting passivation materials of aeronautical IC packages.
Type of Medium:
Online Resource
ISSN:
1662-9752
DOI:
10.4028/www.scientific.net/MSF.575-578
DOI:
10.4028/www.scientific.net/MSF.575-578.919
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2008
detail.hit.zdb_id:
2047372-2
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