In:
Applied Physics Letters, AIP Publishing, Vol. 87, No. 8 ( 2005-08-22)
Abstract:
In situ secondary electron microscope (SEM) characterizations were carried out to study electromigration failure mechanism in dual-damascene Cu interconnect tree structures, which are important for reliability assessment as well as design optimizations of on-chip interconnects. Direct evidence of electromigration-induced degradation in interconnect tree structure consisting of void nucleation and void movement in opposite direction to electron flow along the Cu∕SiNx interface was unraveled. The peculiar electromigration behavior of Cu interconnect tree structures can be clearly understood based on this mechanism. Dependence of electromigration mechanism of a segment in a Cu interconnect tree on current configuration in neighboring interconnect segment is discussed in detail.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2005
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0
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