In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 43, No. 4S ( 2004-04-01), p. 2387-
Abstract:
Spray coating of the photoresist is an attractive technique that offers new processes for realizing three-dimensional structures in a manner compatible with well-established planar photolithography. There are, however, many hurdles to overcome for its development, including the analysis of coating mechanism. Essentially, this is because the method used is the complex gas-liquid two-phase flow. In this paper, the detailed results relating to the resist film deposition inside microstructures of the Si wafer are described, while focusing on the pinhole distribution, which is a serious drawback of the application. In addition, the performance of the pattern transfer over deep ( 〉 1 mm) structures is investigated using a projection-type aligner.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.43.2387
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2004
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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