Format:
Online-Ressource
ISSN:
1527-2648
Content:
To accomplish densification, pure copper (Cu) sintering, which is a solid phase sintering, necessitates extremely high pressure and temperature. The inclusion of an activator can speed up the diffusion of copper atoms, allowing the densification process to proceed more quickly. The carbonized polymer dot (CPD) via ball milling and spark plasma sintering to obtain a composite with full densification at low temperatures. Effects of sintering temperature on interface of CPD–Cu and the impact of CPD as an activator on pure Cu sintering densification are investigated in this study. Following are the results: Cu matrix composites can be densified at low temperatures by adding CPD, CPD/Cu composites have a relative density of 99.4%, and a hardness up to 130.94 HV while sintering temperature is just 550 °C.
In:
day:19
In:
month:01
In:
year:2023
In:
extent:8
In:
Advanced engineering materials, Weinheim : Wiley-VCH Verl., [1999]-, (19.01.2023) (gesamt 8), 1527-2648
Language:
English
DOI:
10.1002/adem.202201549
URN:
urn:nbn:de:101:1-2023012014025292899989
URL:
https://doi.org/10.1002/adem.202201549
URL:
https://nbn-resolving.org/urn:nbn:de:101:1-2023012014025292899989
URL:
https://d-nb.info/1278721193/34
URL:
https://doi.org/10.1002/adem.202201549
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