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  • 1
    UID:
    b3kat_BV036650554
    Format: 1 Online-Ressource , v.: digital
    Edition: Online_Ausgabe London Springer-Verlag London Limited 2008 Springer ebook collection / Chemistry and Materials Science 2005-2008 Sonstige Standardnummer des Gesamttitels: 041171-1
    ISBN: 9781848000261 , 9781848000278
    Series Statement: Engineering Materials and Processes
    Additional Edition: Reproduktion von Silver Metallization 2008
    Language: English
    Subjects: Engineering
    RVK:
    Keywords: Silber ; Metallisieren ; Elektrochemisches Verfahren
    URL: Cover
    URL: Volltext  (lizenzpflichtig)
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Online Resource
    Online Resource
    Boston, MA : Springer Science+Business Media, Inc
    UID:
    b3kat_BV036650344
    Format: 1 Online-Ressource , v.: digital
    Edition: Online_Ausgabe Boston, MA Springer Science+Business Media, Inc 2007 Springer ebook collection / Chemistry and Materials Science 2005-2008 Sonstige Standardnummer des Gesamttitels: 041171-1
    ISBN: 9780387292601 , 9780387292618
    Additional Edition: Reproduktion von Fundamentals of Nanoscale Film Analysis 2007
    Language: English
    Subjects: Physics
    RVK:
    Keywords: Festkörperoberfläche ; Materialcharakterisierung ; Photonenstrahlung ; Teilchenstrahlung ; Nanometerbereich
    URL: Cover
    Library Location Call Number Volume/Issue/Year Availability
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  • 3
    UID:
    almafu_9958115022702883
    Format: 1 online resource (133 p.)
    Edition: 1st ed. 2008.
    ISBN: 1-281-11786-2 , 9786611117863 , 1-84800-027-8
    Series Statement: Engineering materials and processes,
    Content: Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: preparation and characterization of elemental silver thin films and silver-metal alloys; formation of diffusion barriers and adhesion promoters; evaluation of the thermal stability of silver under different annealing conditions; evaluation of the electrical properties of silver thin films under various processing conditions; methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development.
    Note: Description based upon print version of record. , Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary. , English
    Additional Edition: ISBN 1-84996-705-9
    Additional Edition: ISBN 1-84800-026-X
    Language: English
    Library Location Call Number Volume/Issue/Year Availability
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  • 4
    Online Resource
    Online Resource
    New York, NY :Springer US :
    UID:
    almafu_9958073712702883
    Format: 1 online resource (348 p.)
    Edition: 1st ed. 2007.
    ISBN: 1-4419-3980-6
    Content: Modern science and technology, from materials science to integrated circuit development, is directed toward the nanoscale. From thin films to field effect transistors, the emphasis is on reducing dimensions from the micro to the nanoscale. Fundamentals of Nanoscale Film Analysis concentrates on analysis of the structure and composition of the surface and the outer few tens to hundred nanometers in depth. It describes characterization techniques to quantify the structure, composition and depth distribution of materials with the use of energetic particles and photons. The book describes the fundamentals of materials characterization from the standpoint of the incident photons or particles which interrogate nanoscale structures. These induced reactions lead to the emission of a variety of detected of particles and photons. It is the energy and intensity of the detected beams that is the basis of the characterization of the materials. The array of experimental techniques used in nanoscale materials analysis covers a wide range of incident particle and detected beam interactions. Included are such important interactions as atomic collisions, Rutherford backscattering, ion channeling, diffraction, photon absorption, radiative and nonradiative transitions, and nuclear reactions. A variety of analytical and scanning probe microscopy techniques are presented in detail.
    Note: Description based upon print version of record. , An Overview: Concepts, Units, and the Bohr Atom -- Atomic Collisions and Backscattering Spectrometry -- Energy Loss of Light Ions and Backscattering Depth Profiles -- Sputter Depth Profiles and Secondary Ion Mass Spectroscopy -- Ion Channeling -- Electron-Electron Interactions and the Depth Sensitivity of Electron Spectroscopies -- X-ray Diffraction -- Electron Diffraction -- Photon Absorption in Solids and EXAFS -- X-ray Photoelectron Spectroscopy -- Radiative Transitions and the Electron Microprobe -- Nonradiative Transitions and Auger Electron Spectroscopy -- Nuclear Techniques: Activation Analysis and Prompt Radiation Analysis -- Scanning Probe Microscopy. , English
    Additional Edition: ISBN 0-387-29260-8
    Additional Edition: ISBN 0-387-29261-6
    Language: English
    Library Location Call Number Volume/Issue/Year Availability
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  • 5
    UID:
    b3kat_BV022787582
    Format: XI, 123 S. , Ill., graph. Darst.
    Edition: 1. ed.
    ISBN: 9781848000261 , 184800026X
    Series Statement: Engineering materials and processes
    Language: English
    Subjects: Engineering
    RVK:
    Keywords: Silber ; Metallisieren ; Elektrochemisches Verfahren
    Author information: Mayer, James W. 1930-2013
    Library Location Call Number Volume/Issue/Year Availability
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  • 6
    Online Resource
    Online Resource
    New York, NY :Springer US :
    UID:
    edoccha_9958073712702883
    Format: 1 online resource (348 p.)
    Edition: 1st ed. 2007.
    ISBN: 1-4419-3980-6
    Content: Modern science and technology, from materials science to integrated circuit development, is directed toward the nanoscale. From thin films to field effect transistors, the emphasis is on reducing dimensions from the micro to the nanoscale. Fundamentals of Nanoscale Film Analysis concentrates on analysis of the structure and composition of the surface and the outer few tens to hundred nanometers in depth. It describes characterization techniques to quantify the structure, composition and depth distribution of materials with the use of energetic particles and photons. The book describes the fundamentals of materials characterization from the standpoint of the incident photons or particles which interrogate nanoscale structures. These induced reactions lead to the emission of a variety of detected of particles and photons. It is the energy and intensity of the detected beams that is the basis of the characterization of the materials. The array of experimental techniques used in nanoscale materials analysis covers a wide range of incident particle and detected beam interactions. Included are such important interactions as atomic collisions, Rutherford backscattering, ion channeling, diffraction, photon absorption, radiative and nonradiative transitions, and nuclear reactions. A variety of analytical and scanning probe microscopy techniques are presented in detail.
    Note: Description based upon print version of record. , An Overview: Concepts, Units, and the Bohr Atom -- Atomic Collisions and Backscattering Spectrometry -- Energy Loss of Light Ions and Backscattering Depth Profiles -- Sputter Depth Profiles and Secondary Ion Mass Spectroscopy -- Ion Channeling -- Electron-Electron Interactions and the Depth Sensitivity of Electron Spectroscopies -- X-ray Diffraction -- Electron Diffraction -- Photon Absorption in Solids and EXAFS -- X-ray Photoelectron Spectroscopy -- Radiative Transitions and the Electron Microprobe -- Nonradiative Transitions and Auger Electron Spectroscopy -- Nuclear Techniques: Activation Analysis and Prompt Radiation Analysis -- Scanning Probe Microscopy. , English
    Additional Edition: ISBN 0-387-29260-8
    Additional Edition: ISBN 0-387-29261-6
    Language: English
    Library Location Call Number Volume/Issue/Year Availability
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  • 7
    Online Resource
    Online Resource
    New York, NY : Springer
    UID:
    gbv_546653219
    Format: Online-Ressource , Ill., graph. Darst.
    Edition: Online-Ausg. 2007 Springer eBook Collection. Chemistry and Materials Science Electronic reproduction; Available via World Wide Web
    ISBN: 9780387292618
    Note: Literaturangaben , ""Contents""; ""Preface""; ""1 An Overview: Concepts, Units, and the Bohr Atom""; ""2 Atomic Collisions and Backscattering Spectrometry""; ""3 Energy Loss of Light Ions and Backscattering Depth Profiles""; ""4 Sputter Depth Profiles and Secondary Ion Mass Spectroscopy""; ""5 Ion Channeling""; ""6 Electron�Electron Interactions and the Depth Sensitivity of Electron Spectroscopies""; ""7 X-ray Diffraction""; ""8 Electron Diffraction""; ""9 Photon Absorption in Solids and EXAFS""; ""10 X-ray Photoelectron Spectroscopy""; ""11 Radiative Transitions and the Electron Microprobe"" , ""12 Nonradiative Transitions and Auger Electron Spectroscopy""""13 Nuclear Techniques: Activation Analysis and Prompt Radiation Analysis""; ""14 Scanning Probe Microscopy""; ""Appendix 1 KM for 4He+ as Projectile and Integer Target Mass""; ""Appendix 2 Rutherford Scattering Cross Section of Elements for 1 MeV4 He+""; ""Appendix 3 4He+ Stopping Cross Sections""; ""Appendix 4 Electron Configurations and Ionization Potentials of Atoms""; ""Appendix 5 Atomic Scattering Factor""; ""Appendix 6 Electron Binding Energies""; ""Appendix 7 X-Ray Wavelengths (nm)"" , ""Appendix 8 Mass Absorption Coefficient and Densities""""Appendix 9 KLL Auger Energies (eV)""; ""Appendix 10 Table of the Elements""; ""Appendix 11 Table of Fluoresence Yields for K, L, and M Shells""; ""Appendix 12 Physical Constants, Conversions, and Useful Combinations""; ""Appendix 13 Acronyms""; ""Index"" , Electronic reproduction; Available via World Wide Web
    Additional Edition: ISBN 9780387292601
    Additional Edition: Erscheint auch als Druck-Ausgabe Alford, Terry L. Fundamentals of nanoscale film analysis New York, N.Y : Springer, 2007 ISBN 0387292608
    Additional Edition: ISBN 9780387292601
    Additional Edition: ISBN 0387292616
    Additional Edition: ISBN 9780387292618
    Language: English
    Subjects: Engineering , Physics
    RVK:
    RVK:
    Keywords: Photonenstrahlung ; Festkörperoberfläche ; Nanometerbereich ; Teilchenstrahlung ; Materialcharakterisierung
    URL: Volltext  (lizenzpflichtig)
    Library Location Call Number Volume/Issue/Year Availability
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