UID:
almafu_9959227836602883
Format:
1 online resource (xviii, 750 pages) :
,
digital, PDF file(s).
Edition:
1st ed.
ISBN:
1-107-14600-3
,
1-280-43766-9
,
9786610437665
,
0-511-18412-3
,
0-511-16565-X
,
0-511-16372-X
,
0-511-31266-0
,
0-511-75471-X
,
0-511-16452-1
Content:
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Note:
Title from publisher's bibliographic system (viewed on 05 Oct 2015).
,
Cover; Half-title; Title; Copyright; Dedication; Contents; Preface; 1 Introduction and Overview; 2 Film stress and substrate curvature; 3 Stress in anisotropic and patterned films; 4 Delamination and fracture; Film buckling, bulging and peeling; 6 Dislocation formation in epitaxial systems; 7 Dislocation interactions and strain relaxation; 8 Equilibrium and stability of surfaces; 9 The role of stress in mass transport; References; Author index; Subject index
,
English
Additional Edition:
ISBN 0-521-52977-8
Additional Edition:
ISBN 0-521-82281-5
Language:
English
URL:
https://doi.org/10.1017/CBO9780511754715
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