Format:
1 Online-Ressource (XV, 504 p)
ISBN:
9783662108277
,
9783642059155
Series Statement:
Springer Series in MATERIALS SCIENCE 75
Note:
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information
Language:
English
Keywords:
Wafer
;
Bonden
;
Aufsatzsammlung
DOI:
10.1007/978-3-662-10827-7
URL:
Volltext
(lizenzpflichtig)
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