UID:
almahu_9949199572502882
Format:
XV, 504 p. 383 illus., 20 illus. in color.
,
online resource.
Edition:
1st ed. 2004.
ISBN:
9783662108277
Series Statement:
Springer Series in Materials Science, 75
Content:
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Note:
1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding -- 2 Basics of Silicon-on-Insulator (SOI) Technology -- 3 Silicon-on-Insulator by the Smart CutTM Process -- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon -- 5 Wafer Bonding for High-Performance Logic Applications -- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices -- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon -- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach -- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers -- 10 High-Density Hybrid Integration of III-V Compound Optoelectronics with Silicon Integrated Circuits -- 11 Layer Transfer by Bonding and Laser Lift-Off -- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing -- 13 Wafer Bonding of Ferroelectric Materials -- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.
In:
Springer Nature eBook
Additional Edition:
Printed edition: ISBN 9783642059155
Additional Edition:
Printed edition: ISBN 9783662108284
Additional Edition:
Printed edition: ISBN 9783540210498
Language:
English
DOI:
10.1007/978-3-662-10827-7
URL:
https://doi.org/10.1007/978-3-662-10827-7
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