ISBN:
0930815769
Content:
Over the last years, the thickfilm technology for LTCC (Low Temperature Cofired Ceramics) has constantly been improved. Using fine-line and photo-imageable techniques, the possible resolution increased up to 30 mm. However, the problem is that the thickfilm technology is based on bastes or inks, which limits conductivity, accuracy, resolution and chemical processability. The reason for this ist the particle structure of the pastes and inks. For both screen printing and jet printing, well-defined properties are necessary. Furthermore, the typical cofiring process requires special sintering conditions. Therefore, the particle size and the material composition are limited. In this work, various zero-shrinkage techniques for LTCC and especially PAS (Pressure Assisted Sintering) are described, and their features are compared with one another for standard thickfilm applications. Furthermore, the possibilities of the realization of buries bulk materials are explained. Structures of such a kind are compared with screen printed structures. Furthermore, structured metallic bulk materials can be used to realize special kinds of cavities. In contrast to organic inlays, they are removed by etching after sintering, which ensures that the cavities maintain their accuracy during the whole process. This helos to produce large and filigree menbranes and channels as well as to modify the inner surface of the cavities. The new technologies can help to provide the inner layers with more functions and despite the higher production effort, they can increase the spectrum of LTCC multilayers especially in the fields of radio frequency, power and fluidic applications.
In:
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (1 : 2005 : Baltimore, Md.), Proceedings and exhibitor presentations, Washington, DC : Internat. Microelectronics and Packaging Soc. and Sidney J. Stein Educational Foundation, 2005, (2005), Seite 194-198, 0930815769
In:
year:2005
In:
pages:194-198
Language:
English
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