Format:
xxi, 564 p.
,
Ill. (some col.)
Edition:
Online-Ausg. Hoboken, N.J. Wiley InterScience 2011 Online-Ressource ISBN 9780470827826 (electronic bk.)
Edition:
ISBN 0470827823 (electronic bk.)
Edition:
[Online-Ausg.]
ISBN:
9780470827826 (Sekundärausgabe)
,
0470827823 (Sekundärausgabe)
Content:
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--...
Note:
Includes bibliographical references and index
,
Online-Ausg.:
Language:
English
DOI:
10.1002/9780470827826
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9780470827826
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