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2015 European Microelectronics Packaging Conference (EMPC) : date: 14-16 Sept. 2015 (2015)

European Microelectronics and Packaging Conference 20. 2015 Friedrichshafen ; International Microelectronics and Packaging Society Deutschland

[Piscataway, NJ] : IEEE

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UID:

gbv_865446520

Format: 1 Online-Ressource

ISBN: 9780956808622 , 1509001980 , 9781509001989

Note: Tagungsort: Friedrichshafen

Language: English

Keywords: Konferenzschrift

URL: Volltext (lizenzpflichtig)

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Investigation on the suitability of electrically conductive adhesives for die-attachment of power devices (2016)

Möller, Eike [VerfasserIn] ; Middelstädt, Lars [VerfasserIn] ; Grieger, Folkhart [VerfasserIn] ; [et al.]

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UID:

gbv_1810555663

Format: 5

ISBN: 9780956808622

Note: Konferenz: 2015 European Microelectronics Packaging Conference, EMPC, Friedrichshafen, Germany, 14-16 September 2015

In: European Microelectronics and Packaging Conference (20. : 2015 : Friedrichshafen), 2015 European Microelectronics Packaging Conference (EMPC), [Piscataway, NJ] : IEEE, 2015, (2016), 9780956808622

In: 1509001980

In: 9781509001989

In: year:2016

In: extent:5

Language: English

URL: https://ieeexplore.ieee.org/document/7390689

Author information: Lindemann, Andreas

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Kooperativer Bibliotheksverbund

Berlin Brandenburg