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Reliability, Yield, and Stress Burn-In

A Unified Approach for Microelectronics Systems Manufacturing & Software Development

  • Book
  • © 1998

Overview

Authors:
  1. Way Kuo
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  2. Wei-Ting Kary Chien
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  3. Taeho Kim
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Table of contents (12 chapters)

  1. Front Matter

    Pages i-xxvi
    Download chapter PDF

  2. Overview of Design, Manufacture, and Reliability

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 1-24

  3. Integrating Reliability into Microelectronics Manufacturing

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 25-44

  4. Basic Reliability Concept

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 45-64

  5. Yield and Modeling Yield

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 65-91

  6. Reliability Stress Tests

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 93-123

  7. Burn-in Performance, Cost, and Statistical Analysis

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 125-175

  8. Nonparametric Reliability Analysis

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 177-213

  9. Parametric Approaches To Decide Optimal System Burn-in Time

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 215-241

  10. Nonparametric Approach and Its Applications to Burn-in

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 243-259

  11. Nonparametric Bayesian Approach for Optimal Burn-in

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 261-279

  12. The Dirichlet Process for Reliability Analysis

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 281-304

  13. Software Reliability and Infant Mortality Period of the Bathtub Curve

    • Way Kuo, Wei-Ting Kary Chien, Taeho Kim
    Pages 305-332

  14. Back Matter

    Pages 333-394
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Keywords

About this book

The international market is very competitive for high-tech manufacturers to­ day. Achieving competitive quality and reliability for products requires leader­ ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de­ sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur­ ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in­ dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

Bibliographic Information

  • Book Title: Reliability, Yield, and Stress Burn-In

  • Book Subtitle: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

  • Authors: Way Kuo, Wei-Ting Kary Chien, Taeho Kim

  • DOI: https://doi.org/10.1007/978-1-4615-5671-8

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1998

  • Hardcover ISBN: 978-0-7923-8107-5Published: 31 January 1998

  • Softcover ISBN: 978-1-4613-7596-8Published: 14 March 2014

  • eBook ISBN: 978-1-4615-5671-8Published: 27 November 2013

  • Edition Number: 1

  • Number of Pages: XXVI, 394

  • Topics: Manufacturing, Machines, Tools, Processes, Electrical Engineering, Optical and Electronic Materials

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