UID:
edocfu_9961554989902883
Format:
1 online resource (287 pages) :
,
illustrations
Edition:
1.
ISBN:
1-00-300064-9
,
1-000-07052-2
,
1-003-00064-9
,
1-000-07151-0
Content:
The purpose of this book is to provide a complete working knowledge of the Complementary Metal-Oxide Semiconductor (CMOS) analog and mixed-signal circuit design, which can be applied for System on Chip (SOC) or Application-Specific Standard Product (ASSP) development. It begins with an introduction to the CMOS analog and mixed-signal circuit design with further coverage of basic devices, such as the Metal-Oxide Semiconductor Field-Effect Transistor (MOSFET) with both long- and short-channel operations, photo devices, fitting ratio, etc. Seven chapters focus on the CMOS analog and mixed-signal circuit design of amplifiers, low power amplifiers, voltage regulator-reference, data converters, dynamic analog circuits, color and image sensors, and peripheral (oscillators and Input/Output [I/O]) circuits, and Integrated Circuit (IC) layout and packaging. Features: Provides practical knowledge of CMOS analog and mixed-signal circuit design Includes recent research in CMOS color and image sensor technology Discusses sub-blocks of typical analog and mixed-signal IC products Illustrates several design examples of analog circuits together with layout Describes integrating based CMOS color circuit
Note:
Cover -- Half Title -- Title Page -- Copyright Page -- Table of Contents -- Preface -- Acknowledgments -- Author -- Chapter 1: CMOS Analog and Mixed-Signal Circuit Design: An Overview -- 1.1 Introduction -- 1.2 Notation, Symbol, and Terminology -- 1.3 Technology, Circuit Topology, and Methodology -- 1.4 Analog and Mixed-Signal Integrated Design Concepts -- 1.5 Summary -- Chapter 2: Devices: An Overview -- 2.1 Introduction -- 2.2 The PN Junction -- 2.2.1 Fermi Level -- 2.2.2 Depletion Layer Capacitance -- 2.2.3 Storage Capacitance -- 2.3 Photo Devices -- 2.4 FETs -- 2.4.1 Long Channel Approximation -- 2.4.1.1 MOS Structure -- 2.4.1.2 MOS with External Bias -- 2.4.1.3 MOS Operation -- 2.4.1.4 Current-Voltage Characteristics -- 2.4.2 MOSFET Scaling -- 2.4.2.1 Full Scaling -- 2.4.2.2 Constant-Voltage Scaling -- 2.4.3 Weak Inversion -- 2.4.4 Short-Channel -- 2.4.4.1 Carrier Drift Velocity Models -- 2.4.4.2 VDSAT -- 2.4.4.3 Current-Voltage Equation for Short Channel Transistor -- 2.4.5 MOSFET Capacitor -- 2.4.5.1 Oxide-Related Capacitance -- 2.4.5.2 Junction Capacitance -- 2.4.6 MOSFET Transition Frequency -- 2.4.7 Noise -- 2.4.7.1 Thermal Noise -- 2.4.7.2 Flicker Noise -- 2.5 Process Fitting Ratio -- 2.5.1 150-90 nm Design Transfer -- 2.6 MOSFET Parameter Exercise -- 2.7 SPICE Example -- 2.8 Summary -- References -- Chapter 3: Amplifiers -- 3.1 Introduction -- 3.1.1 CMOS Amplifier -- 3.2 Input Voltage Range -- 3.2.1 Theory -- 3.2.2 Example -- 3.3 Signal Path of CMOS Operational Amplifier -- 3.3.1 Overall Signal Path -- 3.3.2 Load -- 3.3.3 Cascode Current Source -- 3.3.4 Example -- 3.4 CMOS Amplifier Parameters -- 3.4.1 Input Offset -- 3.4.2 Common Mode Input Voltage Range -- 3.4.3 Current Consumption -- 3.4.4 Common Mode Rejection Ratio (CMRR) -- 3.4.5 Power Supply Rejection Ratio -- 3.4.6 Slew Rate and Settling Time -- 3.4.7 DC Gain, fs, and fT.
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3.4.8 Noise -- 3.4.9 Distortion -- 3.5 Common Mode Feedback -- 3.6 Compensation in Amplifier -- 3.6.1 Loop Response -- 3.6.2 Pulse Response -- 3.7 Wideband Amplifier Technique -- 3.7.1 Source and Load -- 3.7.2 Stages and Feedback -- 3.8 Noises in Amplifiers -- 3.8.1 Noise in Circuits -- 3.8.2 Noise in Single-Stage Amplifiers -- 3.8.3 Noise in Differential Pairs -- 3.8.4 Noise in Amplifier with Resistors in the Feedback -- 3.8.5 Noise Bandwidth -- 3.9 Current Density Design Approach -- 3.10 Layout Examples -- 3.11 Summary -- References -- Chapter 4: Low Power Amplifier -- 4.1 Introduction -- 4.2 Low Voltage CMOS Amplifier -- 4.2.1 Body or Bulk Control -- 4.2.2 Circuit Technique -- 4.3 Subthreshold -- 4.4 Current Reuse CMOS Amplifier -- 4.5 Other Techniques -- 4.5.1 Common-Gate with Gain-Boosting Wideband Differential LNA -- 4.6 Spice Example -- 4.7 Summary -- References -- Chapter 5: Voltage Regulator, References and Biasing -- 5.1 Introduction -- 5.2 Current Sources -- 5.3 Self-Biased -- 5.4 CTAT and PTAT -- 5.5 Bandgap Voltage Reference -- 5.5.1 Bandgap Reference -- 5.6 Diode-Less Voltage Reference -- 5.7 Cascode Current Source -- 5.8 Regulated Power Supply -- 5.9 Design Example -- 5.10 Spice Example -- 5.11 Layout Example -- 5.12 Summary -- Problems -- References -- Chapter 6: Introduction of Advanced Analog Circuit -- 6.1 Introduction -- 6.2 MOSFET as a Switch -- 6.3 Basic Switched Capacitor -- 6.3.1 Switching Capacitor Sensitive to Parasitic Capacitances -- 6.4 Active Integrator -- 6.4.1 Non-inverting Switching Capacitor Non-sensitive to Parasitic Capacitances -- 6.4.2 Inverting Active Integrator without a Delay -- 6.4.3 Inverting the Switching Capacitor with a Delay, Non-sensitive to Parasitic Capacitances -- 6.4.4 SC Behavior in Discrete Points of Time -- 6.4.5 Non-inverting Active Integrator with a Delay -- 6.5 Sample-and-Hold Amplifier.
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6.6 Programmable Gain Amplifier -- 6.6.1 Timing -- 6.6.2 Common Mode Feedback -- 6.6.2.1 AMP and CMFB -- 6.7 Chopper Amplifier -- 6.8 Dynamic Element Matching Technique -- 6.9 Resistor-Less Current Reference -- 6.10 Switch Mode Converter -- 6.11 SPICE Example -- 6.12 Layout Issue -- 6.13 Summary -- References -- Chapter 7: Data Converter -- 7.1 Introduction -- 7.2 Digital-to-Analog Converter -- 7.2.1 Resistor String Topology -- 7.2.2 Current Steering -- 7.2.3 Hybrid Topology -- 7.2.4 DAC Trimming or Calibration -- 7.2.5 Glitch -- 7.3 Analog-to-Digital Converter -- 7.3.1 Slope ADC -- 7.3.2 SAR ADC -- 7.3.3 Flash ADC -- 7.3.4 Pipelined ADC -- 7.3.5 Delta Sigma ADC -- 7.4 SPICE Example -- 7.4.1 DAC Example -- 7.4.2 ADC Example -- 7.5 Layout Examples -- 7.6 Summary -- References -- Chapter 8: CMOS Color and Image Sensor Circuit Design -- 8.1 Introduction -- 8.2 Technology and Methodology -- 8.2.1 General Comments on Technology or Process for CMOS Image Sensor -- 8.2.2 Backside Illumination -- 8.2.3 Photo Devices -- 8.2.4 Design Methodology -- 8.3 CMOS Color Sensor -- 8.3.1 Transimpedance Amplifier Topology -- 8.3.2 Current to Frequency Topology -- 8.3.3 Current Integration Topology -- 8.4 CMOS Image Sensor -- 8.4.1 CMOS Image Sensor Architecture -- 8.4.1.1 Pixel-Level ADC -- 8.4.1.2 Column-Level ADC -- 8.4.1.3 Chip-Level ADC -- 8.4.2 Analog Pixel Sensor -- 8.4.3 Digital Pixel Sensor -- 8.4.4 Low Power and Low Noise Technique -- 8.4.4.1 Low Power Techniques -- 8.4.4.2 Low Noise Techniques -- 8.5 SPICE Example -- 8.6 Layout -- 8.7 Summary -- References -- Chapter 9: Peripheral Circuits -- 9.1 Introduction -- 9.2 Oscillator -- 9.2.1 Ring Oscillator -- 9.2.2 RC Oscillator -- 9.2.2.1 Ramp Oscillator -- 9.3 Non-overlapping Generator -- 9.4 Interface Circuitry -- 9.4.1 Basic Interface Circuit -- 9.4.2 I2C -- 9.5 I/O Pad -- 9.6 Schmitt Trigger Circuit.
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9.7 Voltage Level Shifters -- 9.8 Power on Reset -- 9.9 ESD Circuit -- 9.10 SPICE Example -- 9.11 Layout Example -- 9.12 Summary -- References -- Chapter 10: Layout and Packaging -- 10.1 Introduction -- 10.2 Process -- 10.2.1 Antenna Rule -- 10.2.2 Electromigration and Metal Density -- 10.2.3 Shear Stress -- 10.3 Floor Planning -- 10.4 ESD and I/O Pad Layout -- 10.4.1 Low Parasitic Capacitance Pad -- 10.4.2 Seal Ring -- 10.5 Analog Circuit Layout Technique -- 10.5.1 Matching -- 10.5.2 Guard Ring -- 10.5.3 Shielding -- 10.5.4 Voltage (IR) Drop -- 10.5.5 Metal over Implant -- 10.5.6 Substrate Tap -- 10.6 Digital Circuit Layout Technique -- 10.6.1 Power Distribution for Mixed-Signal Design -- 10.6.2 Clock Distribution -- 10.6.3 Latch-up -- 10.7 Packaging -- 10.7.1 Die Attach -- 10.7.2 Package Type -- 10.7.3 Package Parasitic -- 10.8 Summary -- References -- Index.
Additional Edition:
ISBN 0-367-43010-X
Language:
English
DOI:
10.1201/9781003000648
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