UID:
almahu_9949685609002882
Umfang:
1 online resource (208 pages)
ISBN:
9781439862070
,
1439862079
,
9786613274601
,
6613274607
,
1283274604
,
9781283274609
,
1439862052
,
9781439862056
,
9781138075405
,
113807540X
,
9780429063350
,
0429063350
,
9781000218619
,
1000218619
Inhalt:
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how.
Anmerkung:
Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover.
Weitere Ausg.:
Print version: Chen, Andrea. Semiconductor Packaging : Materials Interaction and Reliability. Hoboken : CRC Press, ©2011 ISBN 9781439862056
Sprache:
Englisch
Schlagwort(e):
Electronic resource.
;
Electronic resource.
URL:
https://www.taylorfrancis.com/books/9780429063350
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