Umfang:
1 Online-Ressource (718 p)
,
ill
ISBN:
9783035701326
,
3035701326
Serie:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Inhalt:
Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea. The 114 papers are grouped as follows:Chapter 1: GrindingChapter 2: Abrasive Jet MachiningChapter 3: Advanced Cutting TechnologyChapter 4: Processing of Brittle MaterialsChapter 5: Chemical Mechanical Polishing, Processing of Semiconductor WaferChapter 6: Electrical Discharge Machining, Ultrasonic and Beam MachiningChapter 7: Finishing, Lapping and PolishingChapter 8: Surface and Subsurface Integrity and Materials CharacterizationChapter 9: In-Process Measurement and Monitoring, MetrologyChapter 10: Machine Tools and Systems, Tooling Processing Keywords: Abrasive Machining, Advanced Cutting Technology, Grinding, Lapping, Polishing, Finishing, Tribology, Surface Integrity Edited by Choi, Jeong, Xu, and Aoyama, this book is comprised of peer-reviewed papers selected from research presented at the eighteenth International Symposium on Advances in Abrasive Technology, held in October of 215 in Korea. The editors have organized the contributions that make up the main body of the text in ten chapters devoted to grinding, abrasive jet machining, advanced cutting technology, the processing of brittle materials, and other related categories according to use. Individual selections are focused on drilling of microholes using diamond grinding tools, experimental research on flexible polishing by compound diamond powder, and many other topics — Materials science— Mechanical engineering
Anmerkung:
Includes bibliographical references and index
,
Mode of access: World Wide Web.
Sprache:
Englisch
DOI:
10.4028/www.scientific.net/AMR.1136
URL:
Volltext
(Deutschlandweit zugänglich)
URL:
Volltext
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