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2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014) : 22 - 24 Oct. 2014, Taipei, Taiwan ; held in conjunction with the 16th EMAP (International Conference on Electronics Materials and Packaging) (2014)

Components, Packaging, and Manufacturing Technology Society Taipei Chapter

Piscataway, NJ : IEEE

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UID:

gbv_83534343X

Format: Online-Ressource

ISBN: 9781479977284 , 1479977276 , 9781479977277

Note: Kongr.-Thema: Challenge for change - shaping the future

Additional Edition: ISBN 9781479977277

Additional Edition: Druckausg. 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014) Piscataway, NJ : IEEE, 2014 ISBN 9781479977284

Language: English

Keywords: Konferenzschrift

URL: Volltext (lizenzpflichtig)

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