UID:
almafu_9960074034602883
Umfang:
1 online resource (180 pages) :
,
illustrations (some color), graphs
ISBN:
9780081010761
,
0081010761
,
9781785480621
,
1785480626
Anmerkung:
"Advanced Lasers Set."
,
Front Cover -- Integrated Lasers on Silicon -- Copyright -- Contents -- Preface -- Introduction -- Chapter 1: Laser Integration Challenges -- 1.1. Evolution of microprocessor technologies -- 1.2. Photonic integration schemes -- 1.3. Semiconductor lasers -- Chapter 2: Group IV Silicon Lasers -- 2.1. Group IV silicon lasers: issues -- 2.2. Emission from bulk silicon -- 2.3. Using quantum confinement -- 2.4. Raman scattering for lasing -- 2.5. Rare-earth doping -- 2.6. Group IV SiGeSn alloys for lasing -- Chapter 3: III-V Lasers Bonded on Si -- 3.1. Introduction -- 3.2. Historical flip-chip bonding technology: advantages and drawbacks -- 3.3. Die versus wafer bonding -- 3.4. Basic principles of wafer bonding -- 3.5. Basic principles of transfer printing -- 3.6. Device structures and performances of III-V lasers coupled to SOI waveguides -- 3.7. Conclusion -- Chapter 4: Monolithic III-V Lasers on Silicon -- 4.1. The monolithic integration: issues and strategies -- 4.2. Monolithic devices -- Chapter 5: Laser Architectures for On-chip Information Technologies -- 5.1. The role of integrated lasers in hybrid photonic- electronic chips -- 5.2. Laser designs for on-chip routing -- 5.3. Concluding remarks -- Conclusion -- Bibliography -- Index -- Back Cover.
Sprache:
Englisch
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