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Wafer manufacturing : shaping of single crystal silicon wafers (2014)

Cao, Imin, ; Bhagavat, Milind,

Chichester :Wiley-Blackwell,

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UID:

almafu_9959762249102883

Format: 1 online resource.

ISBN: 9781118696224 , 1118696220

Additional Edition: Print version: Cao, Imin. Wafer manufacturing. Chichester : Wiley-Blackwell, 2014 ISBN 9780470061213

Language: English

Keywords: Electronic books. ; Electronic books. ; Electronic books.

URL: https://onlinelibrary.wiley.com/doi/book/10.1002/9781118696224

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Wafer manufacturing : shaping of single crystal silicon wafers (2021)

Kao, Imin ; Chung, Chunhui

Hoboken, NJ : Wiley

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UID:

b3kat_BV047302160

Format: xiv, 290 Seiten , Illustrationen, Diagramme , 25 cm

Edition: First edition

ISBN: 9780470061213 , 0470061219

Note: Includes bibliographical references and index

Additional Edition: Erscheint auch als Online-Ausgabe, PDF ISBN 9781118696255

Additional Edition: Erscheint auch als Online-Ausgabe, EPUB ISBN 9781118696231

Additional Edition: Erscheint auch als Online-Ausgabe ISBN 9781118696224

Language: English

Keywords: Wafer ; Fertigung ; Halbleitertechnologie ; Wafer ; Intelligente Fertigung ; Handhabungstechnik ; Materialflusssystem ; Transportsystem ; Automation ; Computersimulation

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Wafer manufacturing : shaping of single crystal silicon wafers (2021)

Kao, Imin, ; Chung, Chunhui,

Hoboken, New Jersey :John Wiley & Sons, Incorporated,

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UID:

edocfu_9961555382502883

Format: 1 online resource (307 pages) : , illustrations

Edition: First edition.

ISBN: 1-118-69625-5 , 1-118-69623-9 , 1-118-69622-0

Content: "A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."--

Note: Includes index.

Additional Edition: ISBN 0-470-06121-9

Language: English

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