UID:
almafu_9959234387402883
Umfang:
1 online resource (390 p.)
Ausgabe:
2nd ed.
ISBN:
9786611051266
,
9781281051264
,
1281051268
,
9780080480978
,
0080480977
Inhalt:
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, a
Anmerkung:
Previous ed. published as: Surface Mount Technology, 1994.
,
Contents; Preface to the first edition; Preface to the second edition; Glossary; 1 Why SMDs?; 2 The SMD family; 3 Soldering; 4 Wavesoldering; 5 Reflowsoldering; 6 The circuit board; 7 Component placement; 8 Cleaning after soldering; 9 Quality control and inspection; 10 Rework; Index
,
English
Weitere Ausg.:
ISBN 9780750635899
Weitere Ausg.:
ISBN 0750635894
Sprache:
Englisch
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