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14th International Workshop on Thermal Investigation of ICs and Systems : THERMINIC ; 24 - 26 Sept. 2008, Rome, Italy (2008)

Circuits Multi-Projets ; Institute of Electrical and Electronics Engineers ; Components, Packaging, and Manufacturing Technology Society

Piscataway, NJ : IEEE

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UID:

gbv_592748367

Format: Online-Ressource

ISBN: 9782355000089 , 1424433657 , 2355000085 , 9781424433650 , 9782355000089

Note: Includes bibliographical references and author index , Title from PDF title page (IEEE Xplore, viewed on Jan. 8, 2009) , Parallel als Buch-Ausg. erschienen

Language: English

Keywords: Konferenzschrift

URL: Volltext

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