Umfang:
Online-Ressource (XVIII, 532 p, digital)
ISBN:
9783540274704
Serie:
SpringerLink
Inhalt:
This book documents diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.
Anmerkung:
Description based upon print version of record
,
Title Page; Copyright Page; Dedication; Table of Contents; Contributors; Preface; 1 Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples; 1.1 Introduction; 1.2 Diffusion in Single Crystals; 1.3 Structurally Inhomogeneous Samples; 1.4 Some Illustrative Experimental Data; 1.5 General Characteristics of Grain Boundary Diffusion; 1.6 Diffusion in Quasicrystalline and Amorphous Alloys; 1.7 Summary; Acknowledgment; References; 2 Solid State Diffusion and Bulk Properties; 2.1 Introduction; 2.2 Correlations with Bulk Properties
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2.3 Equilibrium Thermodynamic Calculation of Diffusion Parameters2.4 Summary; Acknowledgment; Appendix 2A. Taylor Series Expansion of ?G*; Appendix 2B. Evaluation of Errors in Estimated Parameters; References; 3 Atomistic Computer Simulation of Diffusion; 3.1 Introduction; 3.2 Atomic Interaction Models; 3.3 Molecular Statics; 3.4 Harmonic Approximation; 3.5 Equilibrium Defect Concentrations; 3.6 Transition Rate Calculations; 3.7 Kinetic Monte Carlo Simulations; 3.8 Molecular Dynamics; 3.9 Conclusions; Acknowledgment; References; 4 Bulk and Grain Boundary Diffusion in Intermetallic Compounds
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4.1 Introduction4.2 Crystal Structures and Point Defects in Ni, Ti, and Fe Aluminides; 4.3 Diffusion Mechanisms in Intermetallics; 4.4 Experimental Results on Bulk Diffusion in Ordered Aluminides; 4.5 Discussion of Lattice Diffusion in Intermetallics; 4.6 Grain Boundary Diffusion; 4.7 Summary; Acknowledgments; References; 5 Diffusion Barriers in Semiconductor Devices/Circuits; 5.1 Introduction; 5.2 Diffusion Barriers from the 1960s Through the 1990s; 5.3 Brief Review of Diffusion and the Influencing Material Factors; 5.4 Diffusion Barrier Materials
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5.5 New Concepts in Affecting APDB Behavior at the Interfaces5.6 Brief Discussion of an APDB for LOW-k ILD Materials; 5.7 Summary; Reference; 6 Reactive Phase Formation: Some Theory and Applications; 6.1 Introduction; 6.2 Theoretical Considerations; 6.3 Practical Problems in Electronic Technology; 6.4 Conclusions; Acknowledgments; References; 7 Metal Diffusion in Polymers and on Polymer Surfaces; 7.1 Introduction; 7.2 Diffusion During Nucleation and Growth of Metal Films on Polymers; 7.3 Metal-Polymer Interaction; 7.4 Diffusion in the Polymer Bulk; 7.5 Summary and Conclusions; Acknowledgments
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References8 Measurement of Stresses in Thin Films and Their Relaxation; 8.1 Introduction; 8.2 MeasurementTechniques; 8.3 Stress Relaxation; 8.4 Conclusion; References; 9 Electromigration in Cu Thin Films; 9.1 Introduction; 9.2 Cu Interconnection Integration; 9.3 Test Structure and Experiment; 9.4 Microstructure; 9.5 Theory; 9.6 Resistance and Void Growth; 9.7 Fast Diffusion Paths; 9.8 Lifetime Distribution; 9.9 Current Density Dependence; 9.10 Lifetime vs. Linewidth; 9.11 Lifetime Scaling Rule; 9.12 Short-Length Effect; 9.13 Reduced Cu Interface Diffusion; 9.14 Conclusion; References
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10 Diffusion in Some Perovskites: HTSC Cuprates and a Piezoelectric Ceramic
Weitere Ausg.:
ISBN 9783540219385
Weitere Ausg.:
Buchausg. u.d.T. Diffusion processes in advanced technological materials Norwich, NY : William Andrew, 2005 ISBN 0815515014
Weitere Ausg.:
ISBN 3540219382
Sprache:
Englisch
Fachgebiete:
Technik
Schlagwort(e):
Festkörper
;
Diffusion
;
Hochleistungswerkstoff
;
Diffusion
;
Festkörper
;
Diffusion
;
Hochleistungswerkstoff
DOI:
10.1007/978-3-540-27470-4
URL:
Volltext
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