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  • 1
    Online-Ressource
    Online-Ressource
    Berlin, Heidelberg : Springer Berlin Heidelberg
    UID:
    b3kat_BV042413837
    Umfang: 1 Online-Ressource (VIII, 320p. 77 illus)
    ISBN: 9783642831362 , 9783642831386
    Serie: Springer Series in Materials Science 3
    Anmerkung: This text aims at providing a comprehensive and up to date treatment of the new and rapidly expanding field of laser processing of thin films, particularly, though by no means exclusively, of recent progress in the dielectrics area. The volume covers all the major aspects of laser processing technology in general, from the background and history to its many potential applications, and from the theory to the necessary experimental considerations. It highlights and compares the vast array of processing conditions now available with intense photon beams, as well as the properties of the films and microstructures produced. Separate chapters deal with the fundamentals of laser interactions with matter, and with experimental considerations. Detailed consideration is also given to film deposition, nucleation and growth, oxidation and annealing, as well as selective and localized. etching and ablation, not only in terms of the various photon-induced processes, but also with respect to traditional as well as other competing new technologies
    Sprache: Englisch
    Schlagwort(e): Mikrostruktur ; Laserbearbeitung ; Halbleiterwerkstoff ; Laserbearbeitung ; Dünne Schicht ; Laserbearbeitung ; Dünnschichttechnik ; Laserbearbeitung
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 2
    Online-Ressource
    Online-Ressource
    Berlin, Heidelberg :Springer Berlin Heidelberg :
    UID:
    almahu_9949199149302882
    Umfang: VIII, 320 p. , online resource.
    Ausgabe: 1st ed. 1987.
    ISBN: 9783642831362
    Serie: Springer Series in Materials Science, 3
    Inhalt: This text aims at providing a comprehensive and up to date treatment of the new and rapidly expanding field of laser pro­ cessing of thin films, particularly, though by no means exclu­ sively, of recent progress in the dielectrics area. The volume covers all the major aspects of laser processing technology in general, from the background and history to its many potential applications, and from the theory to the necessary experimental considerations. It highlights and compares the vast array of processing conditions now available with intense photon beams, as well as the properties of the films and microstructures pro­ duced. Separate chapters deal with the fundamentals of laser interactions with matter, and with experimental considerations. Detailed consideration is also given to film deposition, nuclea­ tion and growth, oxidation and annealing, as well as selective and localized. etching and ablation, not only in terms of the various photon-induced processes, but also with respect to traditional as well as other competing new technologies.
    Anmerkung: 1. Introduction -- 1.1 Historical Background -- 1.2 Advantages of Laser Technology -- 1.3 Requirements for Laser Processing -- 1.4 Outline -- 2. Interaction and Kinetics -- 2.1 Laser Excitation of Matter -- 2.2 Laser Excitation of the Gas Species -- 2.3 Interaction of Laser Radiation with Solids -- 2.4 Interactions with Surfaces and Adsorbates -- 2.5 Laser-Induced Heating -- 2.6 Nucleation and Growth -- 2.7 Chemical Reactions and Growth Rates -- 3. Experimental Considerations -- 3.1 Properties of Laser Beams -- 3.2 Spatial Resolution -- 3.3 Modes of Laser Processing -- 3.4 The Choice of Laser -- 4. Laser-Assisted Oxidation and Nitridation -- 4.1 Oxidation -- 4.2 Background and Theory -- 4.3 Metal Oxidation -- 4.4 Silicon Oxidation -- 4.5 Oxidation of Compound Semiconductors -- 4.6 Nitridation -- 4.7 Laser Curing -- 5. Passivation by Laser Annealing and Melting -- 5.1 Modes of Laser Annealing -- 5.2 Laser Annealing in Oxygen -- 5.3 Oxygen Implantation -- 5.4 Nitrogen Implantation -- 5.5 Impurity Effects -- 5.6 Laser Cleaning of Surfaces -- 6. Laser-Induced Deposition -- 6.1 Background -- 6.2 Metal Oxides -- 6.3 Silicon Oxide -- 6.4 Silicon Nitride -- 6.5 Organic Polymer Formation -- 7. Material Removal -- 7.1 Introduction and Background -- 7.2 Etching -- 7.3 Ablation -- 7.4 Trimming -- 7.5 Cutting and Drilling -- 8. Summary and Conclusions -- 8.1 Properties and Applications -- 8.2 Future Prospects -- 8.3 Postscript -- References.
    In: Springer Nature eBook
    Weitere Ausg.: Printed edition: ISBN 9783642831386
    Weitere Ausg.: Printed edition: ISBN 9783540179511
    Weitere Ausg.: Printed edition: ISBN 9783642831379
    Sprache: Englisch
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
    BibTip Andere fanden auch interessant ...
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