Kooperativer Bibliotheksverbund

UID:

Format: 1 online resource (145 p.)

ISBN: 1-282-00229-5 , 9786612002298 , 0-8155-1700-9

Content: This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Note: "The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--P. vii. , Front Cover; Electronics Reliability and Measurement Technology: Nondestructive Evaluation; Copyright Page; Contents and Subject Index; CHAPTER 1. EXECUTIVE SUMMARY OF FINDINGS AND RECOMMENDATIONS; Global Industry Issues; Wafers; Parts; Assemblies; CHAPTER 2. MEASUREMENT SCIENCE AND MANUFACTURING SCIENCE RESEARCH; The Members Dollar; SRC Structure; An Industry View of the Future Direction of Manufacturing Science (Through 1995) Generated by the TAB Manufacturing Sciences Committee; Future Directions of the Manufacturing Sciences Program; Major Trends-Semiconductors; Equipment Implications , Semiconductor Equipment BusinessSemiconductor Capital Investment Plans; Worldwide Sales Forecast; 1985 Semiconductor Equipment Sales; Major Trends-Semiconductor Equipment; Programs; Manufacturing Sciences Principal Thrusts; The SRC/University of Michigan Program in Automated Semiconductor Manufacturing; Manufacturing Sciences Significant Accomplishments; CHAPTER 3. NONDESTRUCTIVE SEM FOR SURFACE AND SUBSURFACE WAFER IMAGING; Introduction; Image Processing Storage and Retrieval; Time Resolved Capacitive Coupling Voltage Contrast; Nondestructive Subsurface Imaging of Semiconductors; References , CHAPTER 4. SURFACE INSPECTION-RESEARCH AND DEVELOPMENTIntroduction; Trends in Surface Analysis; New Front End Detection Techniques; Tool Development; Research Topics; CHAPTER 5. SENSORS DEVELOPED FOR IN-PROCESS THERMAL SENSING AND IMAGING; References; CHAPTER 6. WAFER LEVEL RELIABILITY FOR HIGH-PERFORMANCE VLSI DESIGN; Introduction; Wafer Level Tests; Wafer Level Electromigration Tests; Mobile Ion Contamination; Schottky Diode Structures; Wafer Level Device Reliability; Future Wafer Level Testing; Conclusions; References; CHAPTER 7. WAFER LEVEL RELIABILITY TESTING: AN IDEA WHOSE TIME HAS COME , Planting SeedsInitial Results; With or Without Wafer Level Reliability Testing; CAR; 1986 Workshop; CHAPTER 8. MICRO-FOCUS X-RAY IMAGING; Introduction; The Need for Solder Quality Inspection; Stress and Electrical Testing; Visual Inspection; Structural Inspection; Developing a Solder Quality Inspection Machine; Results Achieved with the First Machine; The Importance of Accept/Reject Thresholds; The"Structural" Solder Quality Standards Problem; Conclusions; CHAPTER 9. MEASUREMENT OF OPAQUE FILM THICKNESS; Introduction; Description of Thermal Waves and Experimental Technique , Thermal Diffusivity of an Isotropic SolidTheoretical Framework for Thin Film Calculations; Numerical Calculations and Experimental Results: Cu Film on Glass; Summary and Conclusions; References; CHAPTER 10. INTELLIGENT LASER SOLDERING INSPECTION AND PROCESS CONTROL; Introduction; Novel Approach: Thermal Flow; The Laser/Inspect System; Statistical Data; Inspecting Tab Assemblies; Intelligent Laser Solderer; CHAPTER 11. RUPTURE TESTING FOR THE QUALITY CONTROL OF ELECTRODEPOSITED COPPER INTERCONNECTIONS IN HIGH-SPEED, HIGH-DENSITY CIRCUITS; Introduction; Type of Interconnecting Material , The Control of Microcracking in Type E Copper , English

Additional Edition: ISBN 1-59124-051-4

Additional Edition: ISBN 0-8155-1171-X

Language: English