In:
physica status solidi (a), Wiley, Vol. 210, No. 3 ( 2013-03), p. 594-599
Abstract:
It is known that there is a very weak bonding between carbon nanotube (CNT) and pure copper matrix since copper is known to be naturally nonwetting with CNT. In this study, the titanium is applied as a matrix‐alloying element and the CNT‐reinforced copper–titanium (Cu–Ti) alloy composites (Cu–Ti/CNT) are fabricated by a powder metallurgical method. The results show that Cu–Ti/CNT composites evidently exhibit enhanced interfacial bonding and yield strength while retaining the electronic conductivity of Cu/CNT composites. Improvements in interfacial bonding and mechanical properties of the composites are attributed to the formation of a thin transition layer of TiC at the interface between CNTs and Cu–Ti matrix.
Type of Medium:
Online Resource
ISSN:
1862-6300
,
1862-6319
DOI:
10.1002/pssa.201228549
Language:
English
Publisher:
Wiley
Publication Date:
2013
detail.hit.zdb_id:
1481091-8
detail.hit.zdb_id:
208850-2