KOBV-Portal

Treffer pro Seite

Treffer 1 - 1 | 1 Treffer

Alles auswählen Exportieren

Online-Ressource

P‐4.9: Thermal simulation research and design of NB high‐end products

Wei, Jun ; Sha, Jin ; Shen, Can ; [weitere]

Wiley ; 2023

In: SID Symposium Digest of Technical Papers Vol. 54, No. S1 ( 2023-04), p. 656-659

zur Merkliste hinzufügen auf der Merkliste

Details

In: SID Symposium Digest of Technical Papers, Wiley, Vol. 54, No. S1 ( 2023-04), p. 656-659

Kurzfassung: At present, the high temperature of high brush products frequently causes membrane wrinkles and IC performance degradation. In this paper, thermal simulation software is used to simulate the temperature distribution of high brush product LCM, and the simulation is used to guide the design, so as to eliminate heat concentration and improve product performance.

Materialart: Online-Ressource

ISSN: 0097-966X , 2168-0159

URL: Issue

URL: Article

DOI: 10.1002/sdtp.v54.S1

DOI: 10.1002/sdtp.16377

Sprache: Englisch

Verlag: Wiley

Publikationsdatum: 2023

ZDB Id: 2526337-7