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Dai, Xiaowan ; Cai, Hongkun ; Zhang, Dexian ; [et al.]

Springer Science and Business Media LLC ; 2016

In: Journal of Materials Science: Materials in Electronics Vol. 27, No. 1 ( 2016-1), p. 705-710

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In: Journal of Materials Science: Materials in Electronics, Springer Science and Business Media LLC, Vol. 27, No. 1 ( 2016-1), p. 705-710

Type of Medium: Online Resource

ISSN: 0957-4522 , 1573-482X

URL: Article

DOI: 10.1007/s10854-015-3806-5

Language: English

Publisher: Springer Science and Business Media LLC

Publication Date: 2016

detail.hit.zdb_id: 2016994-2

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