In:
Quantum Science and Technology, IOP Publishing, Vol. 7, No. 3 ( 2022-07-01), p. 035018-
Abstract:
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
Type of Medium:
Online Resource
ISSN:
2058-9565
DOI:
10.1088/2058-9565/ac734b
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2022
detail.hit.zdb_id:
2906136-2