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    Online Resource
    Online Resource
    Emerald ; 2020
    In:  Microelectronics International Vol. 37, No. 2 ( 2020-05-21), p. 73-78
    In: Microelectronics International, Emerald, Vol. 37, No. 2 ( 2020-05-21), p. 73-78
    Abstract: This paper aims to investigate the usability of the nickel copper zinc ferrite with the composition Ni 0.4 Cu 0.2 Zn 0.4 Fe 1.98 O 3.99 for the realization of high-temperature multilayer coils as discrete components and integrated, buried function units in low temperature cofired ceramics (LTCC). Design/methodology/approach LTCC tapes were cast and test components were produced as multilayer coils and as embedded coils in a dielectric tape. Different metallization pastes are compared. The properties of the components were measured at room temperature and higher temperature up to 250°C. The results are compared with simulation data. Findings The silver palladium paste revealed the highest inductance values within the study. The measured characteristics over a frequency range from 1 MHz to 100 MHz agree qualitatively with the measurements obtained from toroidal test samples. The inductance increases with increasing temperature and this influence is lower than 10%. The characteristic of embedded coils is comparable with this of multilayer components. The effective permeability of the ferrite material reaches values around 130. Research limitations/implications The research results based on a limited number of experiments; therefore, the results should be verified considering higher sample sizes. Practical implications The results encourage the further investigation of the material Ni 0.4 Cu 0.2 Zn 0.4 Fe 1.98 O 3.99 for the use as high-temperature ferrite for the design of multilayer coils with an operation frequency in the range of 5-10 MHz and operation temperatures up to 250°C. Originality/value It is demonstrated for the first time, that the material Ni 0.4 Cu 0.2 Zn 0.4 Fe 1.98 O 3.99 is suitable for the realization of high-temperature multilayer coils and embedded coils in LTCC circuit carriers with high performance.
    Type of Medium: Online Resource
    ISSN: 1356-5362 , 1356-5362
    Language: English
    Publisher: Emerald
    Publication Date: 2020
    detail.hit.zdb_id: 2024931-7
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