In:
IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers (IEEE), Vol. 28, No. 1 ( 2005-02), p. 114-120
Type of Medium:
Online Resource
ISSN:
1521-3323
DOI:
10.1109/TADVP.2004.842291
Language:
Unknown
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date:
2005
detail.hit.zdb_id:
2070853-1