In:
IEEE Transactions on Communications, Institute of Electrical and Electronics Engineers (IEEE), Vol. 71, No. 1 ( 2023-1), p. 296-309
Materialart:
Online-Ressource
ISSN:
0090-6778
,
1558-0857
DOI:
10.1109/TCOMM.2022.3226193
Sprache:
Unbekannt
Verlag:
Institute of Electrical and Electronics Engineers (IEEE)
Publikationsdatum:
2023
ZDB Id:
2028235-7
ZDB Id:
121987-X