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Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Chen, Jui-Chin ; Lau, John H. ; Tzeng, Pei-Jer ; [et al.]

Institute of Electrical and Electronics Engineers (IEEE) ; 2012

In: IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 2, No. 6 ( 2012-06), p. 956-963

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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), Vol. 2, No. 6 ( 2012-06), p. 956-963

Type of Medium: Online Resource

ISSN: 2156-3950 , 2156-3985

URL: Article

DOI: 10.1109/TCPMT.2011.2177663

Language: Unknown

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Publication Date: 2012

detail.hit.zdb_id: 2595289-4

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Kooperativer Bibliotheksverbund

Berlin Brandenburg