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Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn–Ag Microbump

Kim, Youngsoon ; Yoon, Taeshik ; Kim, Tae-Wan ; [et al.]

Institute of Electrical and Electronics Engineers (IEEE) ; 2017

In: IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 7, No. 3 ( 2017-3), p. 371-378

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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), Vol. 7, No. 3 ( 2017-3), p. 371-378

Type of Medium: Online Resource

ISSN: 2156-3950 , 2156-3985

URL: Article

DOI: 10.1109/TCPMT.2016.2631540

Language: Unknown

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Publication Date: 2017

detail.hit.zdb_id: 2595289-4

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Kooperativer Bibliotheksverbund

Berlin Brandenburg