KOBV Portal

Hits per page

hit 1 - 1 | 1 hit

Select All Export

Online Resource

Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

Chou, Tzu-Chieh ; Huang, Shin-Yi ; Chen, Pin-Jun ; [et al.]

Institute of Electrical and Electronics Engineers (IEEE) ; 2021

In: IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11, No. 1 ( 2021-1), p. 36-42

add to watchlist on the watchlist

Details

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), Vol. 11, No. 1 ( 2021-1), p. 36-42

Type of Medium: Online Resource

ISSN: 2156-3950 , 2156-3985

URL: Journal

URL: Article

DOI: 10.1109/TCPMT.5503870

DOI: 10.1109/TCPMT.2020.3037365

Language: Unknown

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Publication Date: 2021

detail.hit.zdb_id: 2595289-4

Library	Location	Call Number	Volume/Issue/Year	Availability

Others were also interested in ...

Online Resource

Open Access Request

Availability (electronic / print)

Link to publisher

hit 1 - 1 | 1 hit

Kooperativer Bibliotheksverbund

Berlin Brandenburg