In:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 20, No. 4 ( 2002-07-01), p. 1311-1316
Kurzfassung:
By using an acid–copper electrolyte without levelers and brighteners, we achieved defect-free filling of 0.13 μm vias with aspect ratio 8:1. This novel electrolyte consisted of copper sulfate (CuSO4⋅5H2O), sulfuric acid (H2SO4), chloride ions (Cl−), and two different average molecular weights of polyethylene glycols (PEG). The smaller-molecular-weight PEG200, with higher diffusion ability, was identified to enhance cupric ions transporting into deep features and was treated as a bottom-up filling promoter. The larger-molecular-weight PEG2000, with higher polarization resistance, provided enough inhibition effect on cupric ion reduction to obtain denser and small-grained deposits in a lower-current-density region, which benefits the filling capability in submicron features. In addition, adding PEG2000 could reduce the interfacial energy between the electrolyte and the opening of trenches/vias to enhance the filling capability.
Materialart:
Online-Ressource
ISSN:
1071-1023
,
1520-8567
Sprache:
Englisch
Verlag:
American Vacuum Society
Publikationsdatum:
2002
ZDB Id:
3117331-7
ZDB Id:
3117333-0
ZDB Id:
1475429-0
