In:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 20, No. 5 ( 2002-09-01), p. 2149-2153
Kurzfassung:
The optimization of Cu electropolishing processes was explored to be in the mass-transfer-limited plateau with a stable limiting current density and in concentrated phosphoric acid by elucidating surface morphologies and potentiodynamic polarization. After electropolishing, the average roughness of polished surfaces achieved to 1.1 nm. Both the x-ray photoelectron spectroscopy and the electrochemical impedance spectroscopy suggest that the existence of a passivation film on the polished surface contributed to the microleveling effect of Cu electropolishing. Moreover, this passivation layer also induces an application of end point in electropolishing.
Materialart:
Online-Ressource
ISSN:
1071-1023
,
1520-8567
Sprache:
Englisch
Verlag:
American Vacuum Society
Publikationsdatum:
2002
ZDB Id:
3117331-7
ZDB Id:
3117333-0
ZDB Id:
1475429-0