In:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 20, No. 6 ( 2002-11-01), p. 2233-2237
Kurzfassung:
100 nm vias were completely filled with copper for interconnect applications using an electrolyte in the presence of polyethylene glycols (PEG) and a hybrid-mode additive, benzotriazole (BTA). Electrochemical analyses indicated that BTA with a higher concentration inhibited the copper deposition rate, whereas BTA with a lower concentration accelerated the copper deposition rate. This electrolyte thus generated an enhanced deposition gradient within a gap because the PEG molecules and the high concentration of BTA, adsorbed at the opening of the gap, inhibited the deposition. Meanwhile, a little BTA diffused into the inner part of the gap and thus accelerated the deposition of copper. Therefore, this two-component (PEG and BTA) additive electrolyte had the capacity of a three-additive bath (accelerators, suppressors, and levelers).
Materialart:
Online-Ressource
ISSN:
1071-1023
,
1520-8567
Sprache:
Englisch
Verlag:
American Vacuum Society
Publikationsdatum:
2002
ZDB Id:
3117331-7
ZDB Id:
3117333-0
ZDB Id:
1475429-0
