In:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 21, No. 2 ( 2003-03-01), p. 858-861
Kurzfassung:
The leveler, 2-mercaptopyridine (2MP), increases the filling power of copper electroplating electrolytes in plating 0.15 μm vias, but forms the plated copper metals of small-grained column structures with high resistivity. In this study, we used rapid thermal annealing (RTA) to effectively improve the film quality. After RTA at 400 °C for 30 s, the resistivity of Cu deposits was reduced from ∼16.1 to ∼2.4 μΩ cm. Moreover, the Cu(111) intensity of Cu deposits increased after RTA annealing.
Materialart:
Online-Ressource
ISSN:
1071-1023
,
1520-8567
Sprache:
Englisch
Verlag:
American Vacuum Society
Publikationsdatum:
2003
ZDB Id:
3117331-7
ZDB Id:
3117333-0
ZDB Id:
1475429-0