In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 31, No. 11R ( 1992-11-01), p. 3483-
Abstract:
Reversible bonding of silicon wafers can be used to protect mirror polished silicon surface against organic contamination and particles. The present paper will report on debonding experiments of room-temperature bonded wafer pairs. It is found the water can significantly enhance the equilibrium crack length created by a blade inserted between two bonded wafers. A simple analytical model of this phenomenon is proposed which takes into account the interfacial energy between silicon and water. Combined with the “one-wafer bent” concept, it is anticipated that room-temperature reversibly bonded wafers with diameters up to 8 inches can be easily separated by using this technique. Water-enhanced debonding appears to be suitable for industrial applications due to its compatibility with main stream integrated circuit technology.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.31.3483
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
1992
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
