In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 33, No. 4B ( 1994-04-01), p. L617-
Abstract:
µ-Auger analysis of the veil structure produced during Al–Si–Cu etching indicates the presence of carbon, oxygen, aluminum, and chlorine in all regions of the structure and silicon in the outer region. A novel two-step etching method deyeloped based on the veil-structure analysis can suppress corrosion when using CF 4 , and O 2 +CF 4 gas plasma. This method drastically decreases the corrosion density.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.33.L617
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
1994
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7