In:
ECS Transactions, The Electrochemical Society, Vol. 33, No. 36 ( 2011-04-25), p. 11-21
Kurzfassung:
In the work presented here, we focused on fabrication of Cu nails for 3D Stacked-Integrated-Circuits (3D-SIC) applications using electrochemical deposition from the bath with model ('open source') additives. We have studied the effects of bath composition on the Cu fill profile and overburden, and have also examined the correlations between phenomena observed during post-plating-processing and bath composition. Based on these results, we explored different approaches to improving Cu removal rate during Chemical Mechanical Polishing (CMP).
Materialart:
Online-Ressource
ISSN:
1938-5862
,
1938-6737
Sprache:
Unbekannt
Verlag:
The Electrochemical Society
Publikationsdatum:
2011
