In:
High Performance Polymers, SAGE Publications, Vol. 28, No. 8 ( 2016-10), p. 962-970
Abstract:
A series of imide resins were prepared using 2,3,3′,4′-oxydiphthalic dianhydride, 4-phenylethynylphthalic anhydride, and aromatic diamines (1, 3-bis(3-aminophenoxy), 3,4′-oxyaniline, 2,2′-bis (trifluoromethyl) benzidine, and m-phenylenediamine) as starting materials. These imide oligomers were characterized by means of Fourier transform infrared spectroscopy, differential scanning calorimetry, intrinsic viscosity measurements, and rheological measurements. Some of these oligomers exhibited low ( 〈 1 Pa·s at 250°C) and stable ( 〉 2 h at 250°C) melt viscosity, which was highly desirable for resin transfer molding process. Thermosetting polyimides (PIs) were then produced from these oligomers via thermal cross-linking reaction of phenylethynyl group. The properties of the thermosets were studied using tensile and flexural testing, dynamic mechanical thermal analysis, and thermogravimetric analysis. The cured PIs exhibited a good combination of thermal and mechanical properties, with a tensile strength of 31–76 MPa, flexural strength of 38–142 MPa, glass transition temperatures of 233–358°C, and 5% weight loss temperatures of 540–545°C under nitrogen atmosphere.
Type of Medium:
Online Resource
ISSN:
0954-0083
,
1361-6412
DOI:
10.1177/0954008315611470
Language:
English
Publisher:
SAGE Publications
Publication Date:
2016
detail.hit.zdb_id:
1483713-4
