In:
MRS Proceedings, Springer Science and Business Media LLC, Vol. 1079 ( 2008)
Abstract:
The integration of high-density CNT bundles as via interconnects in a CNT/Cu-hybrid BEOL stack is evaluated. CNT via-conduits may greatly improve heat dissipation and as such lower interconnect resistance and improve electromigration resistance. Each carbon shell of the nanotube contributes to electrical and thermal conduction and densities as high as 5×10 13 shells per cm 2 are estimated necessary. CNT growth processes on BEOL compatible metals are presented with tube densities up to 10 12 cm −2 and shell densities approaching 10 13 cm −2 on blanket substrates. Selective growth of CNT bundles with carbon shell densities around 10 12 cm −2 is demonstrated with high yield. Ohmic behavior of TiN/CNT/Ti contacts is shown with a CNT via resistivity of 1.2 mΩ cm.
Type of Medium:
Online Resource
ISSN:
0272-9172
,
1946-4274
DOI:
10.1557/PROC-1079-N06-01
Language:
English
Publisher:
Springer Science and Business Media LLC
Publication Date:
2008