In:
Polymers, MDPI AG, Vol. 12, No. 11 ( 2020-10-28), p. 2510-
Kurzfassung:
A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.
Materialart:
Online-Ressource
ISSN:
2073-4360
DOI:
10.3390/polym12112510
Sprache:
Englisch
Verlag:
MDPI AG
Publikationsdatum:
2020
ZDB Id:
2527146-5
