In:
Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 488-489 ( 2011-9), p. 573-576
Abstract:
In this study the adhesive joint fracture behaviour of a nano-toughened epoxy adhesive was investigated. Two experimental test methods were used; (i) the standard tapered double cantilever beam (TDCB) test to measure the mode I adhesive joint fracture energy, G IC , as a function of bond gap thickness and (ii) a circumferentially deep notched tensile test to determine the cohesive strength of the adhesive for a range of constraint levels. It was found that the fracture energy of the adhesive followed the well-known bond gap thickness dependency [1]. SEM analysis of the TDCB fracture surfaces revealed significant plastic void growth. Finally, numerical modelling of the experimental tests suggested that most of the fracture energy was dissipated via highly localised plasticity in the fracture process zone ahead of the crack tip.
Type of Medium:
Online Resource
ISSN:
1662-9795
DOI:
10.4028/www.scientific.net/KEM.488-489
DOI:
10.4028/www.scientific.net/KEM.488-489.573
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2011
detail.hit.zdb_id:
2073306-9
