In:
Solid State Phenomena, Trans Tech Publications, Ltd., Vol. 195 ( 2012-12), p. 25-29
Abstract:
Conventional aqueous wet cleaning methods in semiconductor manufacturing are facing tremendous challenges, with decreasing line widths and high aspects ratio features on the order of a few nanometers. Water and other liquids have surface tensions that frequently prevent complete penetration into nanometer-sized trenches and vias now being fabricated on semiconductor wafers and other substrates. This problem is accentuated by the fact that particle sizes leading to Killer defects are now on the order of 10 nm or less. Nanometer-sized particles can adhere to a surface with a relatively strong force of over a million times its weight. An effective cleaning technique for submicron particle removal will require complete penetration of the device features to surround and dislodge particles, but at the same time not damage the features or etch the surface.
Type of Medium:
Online Resource
ISSN:
1662-9779
DOI:
10.4028/www.scientific.net/SSP.195
DOI:
10.4028/www.scientific.net/SSP.195.25
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2012
detail.hit.zdb_id:
2051138-3
